Grupo Oesía and Lockheed Martin to jointly promote photonic chip technologies

Grupo Oesía and Lockheed Martin to jointly promote photonic chip technologies

With the presence of Lieutenant General Ivorra, Director General of the Defense Industry Strategy and Innovation Directorate, the Spanish multinational Grupo Oesía and Lockheed Martin have signed a research agreement within the framework of FEINDEF 2025, marking an important milestone in the development of photonic technologies.

With the increasing rise of 6G networks, which will surpass the capabilities of current 5G systems, Lockheed Martin and Grupo Oesía see potential to overcome the limitations of current electronics-based wireless systems. Using photons instead of electrons could reduce bandwidth costs and increase their availability worldwide, while also bringing key advances in aerospace and defense applications.

The agreement signed yesterday at FEINDEF seeks to explore how new technologies can overcome the limitations of Photonic Integrated Circuits (PICs), used to transmit, process, or detect information in both the commercial and defense sectors. It seeks to accelerate and improve secure communications, highlighting the strategic importance of integrated photonics and reinforcing the value of global industrial collaboration.

It was signed by Ray Piselli, Vice President of International Business at Lockheed Martin, and Luis Furnells, President and CEO of Grupo Oesía, and paves the way for the development of a new type of photonic integrated circuit using a unique material composition called lithium niobate-on-insulator. This technology is expected to enable more efficient information transfer, in tasks ranging from strengthening commercial wireless networks to transforming defense systems.

For the joint development of the project, Lockheed Martin is fully committed to contributing its world-class Advanced Technology Laboratories, with three research centers in the United States, and Grupo Oesía will contribute its Photonic Technologies Innovation Center in Valencia, which includes an R&D investment of €10 million over the period 2025-2030.

Luis Furnells, President and CEO of Grupo Oesía, stated: “This project is a very significant example of our strategy as a Spanish multinational specialized in dual-use digital and industrial engineering and of the pillars that have made us a relevant player in the industrial security and defense sector: hyper-specialization through investment in innovation and the development of key disruptive dual-use technologies, as well as strategic technological alliances with industry leaders, such as Lockheed Martin, a global leader in defense platforms and systems.”

“This agreement underscores Lockheed Martin’s long-standing commitment to advancing transatlantic security by collaborating with allies in Europe and NATO to develop and deliver innovative capabilities that protect our citizens,” stated CEO Piselli. “By combining the innovative strengths of Grupo Oesía and Lockheed Martin, we are creating a powerful team to address a complex challenge facing both the U.S. and European defense industries.”

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The International Defence and Security Exhibition of Spain, FEINDEF, is a biennial event organized by Fundación Feindef, with the institutional support of the Ministry of Defence of Spain. With four halls and an exhibition area of over 60,000 m², FEINDEF 25 is firmly established as the leading platform for showcasing our companies and organizations to the international market.

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